Fabrication processes of a complicated channel system integrated with miniaturized pressure, miniaturized temperature sensors and heaters. a Deposition of a 0.1 μm thick LPCVD nitride is followed by deposition of a 0.3 μm thick LPCVD poly-silicon layer which is patterned into temperature sensors. b After deposition of a 0.3 μm thick LPCVD TEOS layer as insulation, a 0.3 μm thick LPCVD polysilicon layer is deposited and patterned into heater and pressure sensors. A 0.3 μm thick LPCVD TEOS layer is deposited as insulation with contact holes opening for metallization. c A desired thickness of SU-8 layer is spin coated on the substrate as a pressure diaphragm. d A 50 μm thick SU-8 layer is spin coated and made into the cavities which are enclosed by a flexible PET plate, and then bonded with Pyrex glass with epoxy resin. e Remove the silicon substrate in order to move the sensor devices onto Pyrex glass substrate. f Another SU-8 layer is spin coated on the epoxy-glass substrate at desired thickness and patterned as a rectangular micro-channel. After a flexible PET plate is used to enclose the channel, a PMMA plate is then bonded
After annealing at 950°C for 30 min, doped film is patterned
as temperature sensors, as shown in Fig. 6a. .
The Cr/Au metal was deposited by E-Beam with a thickness of
0.03/0.3 μm, respectively, and patterned into circuits, as
shown in Fig. 6b..
This is done first by bonding the silicon wafer with the Pyrex
glass, as shown in Fig. 6b, using epoxy resin as the bonding
Then a PMMA plate is bonded, using epoxy resin, with the
epoxy-glass substrate to re-enforce the channel, as shown in
Viewing this image requires a subscription. If you are a subscriber, please log in.
This image is from the article titled "Microscale thermal fluid transport process in a microchannel integrated with arrays of temperature and pressure sensors"
(from Microfluidics and Nanofluidics), which is copyrighted by Springer-Verlag. For more information on the
copyright for this image, please refer to the full image caption and to the
The image is being made available for non-commercial purposes for subscribers to SpringerImages. For more information on what you are allowed to do with this image, please see our copyright policy.
To request permissions to use any copyrighted material, please visit the source document.
Report a copyright concern regarding this image.
Log in or register to save your favorite images and download them as high-quality PowerPoint or PDF files.
Log in or register to save your search criteria.
© Springer, part of Springer Science+Business Media.
Remote Address: 18.104.22.168 Server: 18